30 ต.ค. 2562  Düsseldorf / Germany

New high-tech facility as global hub for the electronics business

Henkel celebrates groundbreaking of new plant in Korea

Henkel has held the groundbreaking ceremony for a new production facility in the high-tech industrial cluster in Songdo, Korea. With an investment of more than 30 million euros, the new plant will become a global production hub for the electronics business of Henkel Adhesive Technologies. More than 50 guests attended the ceremony, including Stephan Auer, the German Ambassador to South Korea, Barbara Zollmann, President of the Korean-German Chamber of Commerce and Industry, Hyun-Nam Park, Vice Chair of the European Chamber of Commerce in Korea, Won-jae Lee, commissioner of the Korean investment project IFEZ, Mark Dorn, President of Henkel Asia-Pacific and Steven Kim, President of Henkel Korea.

“The investment in the new plant is a strong commitment into the Korean market and especially meaningful since this year marks our 30th anniversary for Henkel in Korea,” commented Steven Kim. “The new plant will produce high-impact solutions for the global electronics industry and represents a strategic expansion of our capabilities to serve our customer base for example in the markets for semiconductors and mobile phones.”

The Songdo Plant will have a gross area of 10,144m2 in a two-story building and will commence full production in Q1 of 2022. The new facility will be designed as a high-tech smart factory including a comprehensive building management system (BMS). In addition, the production facilities will fulfill high sustainability standards and be equipped with the state-of-the-art technologies such as solar energy panels, rainwater recycling system, high-efficiency equipment for energy conservation and securing of green land.

Henkel provides customers in electronics with a broad portfolio of high-impact solutions in adhesives, sealants and thermal technologies. The products and materials are used in a broad variety of electronic devices semiconductor packaging, electronic component and device assembly.